SK hynix
SemiconductorsDirect Greenhouse career site

Advanced Package Design Engineer

Pay
$110,000 – $155,000 per year
Location
San Jose, CA · On-site
Job type
Full-time
Level
Senior
Experience
3+ years
Education
Bachelor's degree
Listed
30 days ago

Skills & highlights for this role

  • Virtuoso/APD
  • Synopsys Custom Compiler
  • Siemens Xpedition
  • high-speed signal routing
  • PDN

Also useful

  • Ansys
  • HFSS
  • ADS
  • 2.5D/3D packaging

Stated benefits & perks

  • Health
  • 401k match
  • Pto

Job Summary

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You'll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions

Responsibilities

  • Design silicon and organic interposers for advanced packaging solutions
  • Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
  • Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design.
  • Create and maintain layout design rules, stack-ups, and layout guidelines
  • Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development

Qualifications

  • Bachelor's or Master's degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field.
  • 3+ years of experience in semiconductor package design or layout
  • Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
  • Understanding of high-speed signal routing, power distribution networks (PDN)
  • Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
  • Effective communication skills and ability to work in a fast-paced, cross-functional environment

Preferred Qualifications

  • Currently pursuing a PhD's degree in Electrical Engineering or a related field
  • 5+ years of experiences in advanced packaging layout design
  • Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
  • Proven understanding of high-speed signal routing, power distribution networks (PDN)
  • Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques

Benefits

  • Top Tier health insurance at no employee cost
  • Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
  • 401k Matching
  • Flexible Spending Account (FSA) for Health Care & Dependent Care
  • Educational reimbursement up to $10,000 per year
  • Donation Matching and volunteering opportunities
  • Corporate discount programs
  • Free Breakfast/Lunch/Dinner provided to employees

Compensation

Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.

About SK hynix America

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers.

With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

Work Model: Onsite

Read the original posting

From SK hynix's careers page, first listed on Rolev.ai on October 10, 2026. Rolev.ai is not the employer.

How Rolev.ai helps with this application

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Common questions

What is the salary for the Advanced Package Design Engineer role at SK hynix?

The Advanced Package Design Engineer posting at SK hynix states compensation of $110,000 – $155,000 per year. It is listed as a full-time position. Final pay may depend on location, experience, and interview evaluation on SK hynix's official career site.

Where is the Advanced Package Design Engineer job at SK hynix located?

This Advanced Package Design Engineer position at SK hynix is located in San Jose, CA (On-site). Always check SK hynix's application page for specific state eligibility or relocation policies.

What qualifications are required for Advanced Package Design Engineer at SK hynix?

For the Advanced Package Design Engineer role, SK hynix highlights 3+ years of relevant experience; a bachelor's degree; experience with Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition, high-speed signal routing, PDN. Rolev.ai can score your existing resume against these requirements and show any skill gaps before you apply.

How do I apply for the Advanced Package Design Engineer position at SK hynix?

This listing links directly to SK hynix's Greenhouse application page. You can apply directly on SK hynix's site, or use Rolev.ai to check your resume fit, generate a zero-hallucination tailored resume and cover letter for this posting, and autofill the Greenhouse application form in 1 click with the Rolev.ai Chrome extension. You always review the form and press Submit yourself.