Director of Semiconductor Technology

Why This Role Matters

Every Helion fusion pulse runs current through semiconductor switches operated well beyond commercial ratings. Our next generation of fusion machines requires devices designed for our circuits rather than adapted to them, gated devices integrated as multi-die modules, and packaging that survives repetitive high-energy pulsing for power plant-scale lifetimes.

You will lead the team that delivers these, from device physics through a development-scale fabrication capability to pilot module assembly and test, and you will carry it into high-volume production with external fabrication partners. Your team’s work will help determine how reliably Helion’s power plants operate, how frequently they can pulse, and how effectively we can manufacture and deploy future plants.

What You Will Be Doing

• Own Helion’s semiconductor roadmap, working with technical leadership to define device requirements and deliver the capabilities needed for successive generations of fusion machines. Bring the technical judgment on which devices we build, which we source, and how the roadmap supports successive generations of fusion machines
• Build and lead a focused, multi-disciplinary team of semiconductor scientists, device R&D engineers, and technicians
• Stand up a development-scale device fabrication, characterization and reliability capability, and own the tooling, process, and facility decisions behind it
• Direct in-house device design, including alternative device topologies optimized for Helion's pulsed-power circuits
• Drive novel packaging and integration: multi-die packages for gated devices used in series, deeply integrated thermal management for repetitive operation, and the reliability program that qualifies them
• Establish and lead partnerships with high-volume fabrication facilities so that devices developed in-house transfer cleanly to production at scale. Continue to develop Helion's existing device vendor relationships
• Plan and run a multi-million-dollar development program, including scope funded through external research partnerships, with the rigor, reporting, and risk management to match
• Work with electrical, mechanical, science, operations, and systems leadership to develop semiconductor capabilities and machine architecture together

Required Skills

• 12+ years in semiconductors, including 5+ years leading technical teams
• A track record of hiring and developing engineers and technical leaders, and setting a culture of high performance and delivery
• Deep expertise in power semiconductor device physics and design, including device modeling and design for reliability
• Hands-on expertise in high-power packaging and module integration: die attach, interconnect, and thermal management
• Experience taking a custom semiconductor device from concept through fabrication, characterization, qualification, application integration, and high-volume production with external fabricators
• Experience owning a multi-year R&D program with a budget in the tens of millions, from planning and vendor contracting through executive-level reporting
• Set technical direction across disciplines you do not directly practice, and to make build/buy tradeoffs considering performance, reliability, cost, schedule, and manufacturing scale
• Bachelor’s degree in electrical engineering, Physics, Materials Science or a related field

#LI-Onsite #LI-MT1

Benefits

Our total compensation package includes benefits, including but not limited to:

• Medical, Dental, and Vision plans for employees and their families
• 31 Days of PTO (21 vacation days and 10 sick days)
• 10 Paid holidays, plus company-wide winter break
• Up to 5% employer 401(k) match
• Short term disability, long term disability, and life insurance
• Paid parental leave and support (up to 16 weeks)
• Annual wellness stipend