Director Pathfinding Solutions - Integrated Materials Solutions

Salary

$176,000.00 - $242,000.00

Location: Albany,NY

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to

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Role Summary

The Director, Pathfinding Solutions will serve as a deep technical leader and hands-on contributor who develops next-generation semiconductor process solutions spanning logic and memory device architectures. This individual will operate at the intersection of process engineering, device physics, and materials science — working across Applied's product Business Units to assemble and de-risk integrated pathfinding solutions for N+1, N+2 and beyond technology nodes.

This is a technically distinguished individual contributor role at the E5 / Director level. The ideal candidate is a recognized expert in advanced semiconductor process integration — someone who can independently conceive, develop, and demonstrate pathfinding solutions, engage credibly with customer technologists at senior levels, and influence Applied's product roadmaps through deep technical insights. This is not a traditional people management role; it is a technical leadership position that demands world-class expertise, creativity, and execution.

Key Responsibilities

Pathfinding Solution Development

• Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and / or memory (DRAM 4F2, 3D DRAM, NAND) device architectures
• Drive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing — connecting individual process steps into integrated module flows
• Identify and de-risk critical process challenges for N+1 and N+2 (solving integration problems) technology nodes through systematic experimentation and DTCO (Design-Technology Co-Optimization) analysis
• Translate customer device performance targets (e.g., contact resistance reduction, carrier mobility enhancement, low-k integration, high-selectivity etch) into actionable Applied process solutions

Cross-BU Technical Integration

• Work across Applied's product BUs to assemble end-to-end process flows that demonstrate Applied's differentiated value
• Partner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirements
• Collaborates with DTCO for integration-level analysis that connects individual process capabilities to device-level performance metrics (Vt, Idsat, leakage, RC delay, capacitance, resistance, strain, thermal, NAND)
• Coordinate wafer flow, DOE design, and data analysis across multiple BU tools and process modules

Customer Technical Engagement

• Engage directly with senior technologists at key customers (Samsung, Intel, TSMC, SK Hynix, Micron etc) as a credible technical peer — presenting data, discussing integration approaches, and aligning on pathfinding priorities
• Lead technical discussions in customer Technology Review Meetings (TRMs), performance task forces, and pathfinding workshops
• Translate customer integration challenges into Applied-actionable development programs and demo plans
• Support customer co-development engagements by providing deep process expertise and integration guidance

Technical Thought Leadership

• Publish at premier conferences (IEDM, VLSI, ISSCC, IRPS) and in top journals to establish Applied's technical leadership in pathfinding
• Build a strong patent portfolio in advanced process integration and pathfinding solutions
• Contribute to Applied's internal technical community through seminars, reviews, and mentoring of junior engineers
• Stay at the forefront of semiconductor technology trends — including device architecture evolution, new materials, and emerging integration challenges

Qualifications

Required

• Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline
• 10+ years of experience in semiconductor process development, integration, or device engineering — with deep expertise in FEOL, MOL, or BEOL process technologies
• Demonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodes
• Strong publication record at top-tier semiconductor conferences (IEDM, VLSI, IRPS) and/or a significant patent portfolio
• Experience engaging directly with customer technical teams at major semiconductor manufacturers (IDMs, foundries, memory makers)
• Deep understanding of device physics, process-structure-property relationships, and DTCO principles
• Ability to work effectively across organizational boundaries — coordinating with multiple BUs, product teams, and customer organizations
• Exceptional analytical, problem-solving, and communication skills

Preferred

• Experience collaborating with or working at a semiconductor equipment or materials company with exposure to multiple process technologies
• Track record as a Distinguished Member of Technical Staff (DMTS) or equivalent technical leadership designation
• Experience with advanced device architectures including Gate-All-Around (GAA), Complementary FET (CFET), 3D DRAM, or 4F2 DRAM, NAND
• Familiarity with advanced metallization (Mo, Cu, W, etc.), selective processes, and novel patterning approaches
• Prior experience at a leading semiconductor manufacturer in a process integration or device engineering role
• Strong network in the semiconductor technical community

What Sets This Role Apart

This is not a management or strategy role — it is a deeply technical, hands-on position for someone who thrives on solving the hardest process integration challenges in the semiconductor industry. The ideal candidate will mirror the profile of our top-performing technical leaders who:

• Own end-to-end pathfinding solutions from concept through customer demonstration
• Are recognized as go-to technical experts by both internal teams and external customers
• Can independently drive complex multi-BU process development programs
• Combine deep domain expertise with broad integration thinking
• Elevate Applied's technical brand through publications, patents, and customer engagements
• Operate with high autonomy and impact at the intersection of technology and customer value
• Additional Information
• Time Type: Full time
• Employee Type: Assignee / Regular
• Travel: Yes, 10% of the Time
• Relocation Eligible: Yes

Pay and benefits

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

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