Director, System in Package Architecture
- Pay
- $240,000 – $300,000 per year
- Location
- San Jose, CA · On-site
- Job type
- Full-time
- Level
- Director
- Experience
- 7+ years
- Education
- Bachelor's degree
- Listed
- 31 days ago
Skills & highlights for this role
- advanced packaging architecture
- signal integrity
- power integrity analysis
- HBM architecture
Also useful
- large body substrate technologies
- test vehicle design
Stated benefits & perks
- Health
- 401k match
- Pto
Responsibilities
- Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM).
- Drive mechanical and electrical test vehicle design and development when necessary.
- Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments.
- Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market.
Minimum Qualifications
- BS in Electrical Engineering or equivalent combination of education and progressive industry experience.
- 7+ years of specialized experience in advanced packaging architecture definition, strategy, and development.
- Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions.
- Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred.
- Exceptional verbal and written communication skills, with the ability to articulate technical strategies.
Preferred Qualifications
- Master's degree or PhD in Electrical Engineering, Materials Science, or related field.
- 10+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies.
- Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies.
- Strong proficiency in Signal Integrity (SI) and Power Integrity (PI) analysis and optimization.
- Direct experience in High Bandwidth Memory (HBM) architecture and integration is highly desirable.
Benefits
- Top Tier health insurance at no employee cost
- Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
- 401k Matching
- Flexible Spending Account (FSA) for Health Care & Dependent Care
- Educational reimbursement up to $10,000 per year
- Donation Matching and volunteering opportunities
- Corporate discount programs
- Free Breakfast/Lunch/Dinner provided to employees
Compensation
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
About SK hynix America
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers.
With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Equal opportunity and legal notices
SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.
In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:
- E-Verify Participation Poster (Bilingual English & Spanish)
- IER Right to Work Poster (English)
- IER Right to Work Poster (Spanish)
From SK hynix's careers page, first listed on Rolev.ai on October 10, 2026. Rolev.ai is not the employer.
How Rolev.ai helps with this application
Rolev.ai is a job search and application tool for US job seekers. For this Director, System in Package Architecture role at SK hynix, it shows how your resume fits, tailors your resume to the posting, and prepares the application for you to review.
See how you fit
Openings from employer career sites are ranked against your whole resume—and searchable inside Claude, ChatGPT, and Cursor via Rolev.ai MCP.
Tailor without inventing
Every change to your resume is checked against your original. New experience goes in only with your yes—zero fabricated claims.
Draft the full kit
Tailored and Full Match resumes, role-specific cover letters, and answers to employer screening questions are prepared in seconds.
1-Click Extension Autofill
The Chrome extension fills the employer's Greenhouse, Workday, Lever, or Ashby form in 1 click. You review it and press Submit.
Similar roles
All Engineering Manager jobs- Engineering Manager - Promotional Artwork EngineeringNetflix · Los Gatos, CA · $436k – $710k/yr
- Engineering ManagerSunSource · Hartland, WI
- Engineering ManagerDeploy · San Francisco, CA
- New Product Development - Sr. Refrigeration Systems EngineerCarrier · East Syracuse, NY
- Engineering Manager, Sustaining & LifecycleTrane Technologies · Pueblo, CO
- Senior Principal SEIT LeadNgc · Baltimore, MD · $136k – $204k/yr
Common questions
What is the salary for the Director, System in Package Architecture role at SK hynix?
The Director, System in Package Architecture posting at SK hynix states compensation of $240,000 – $300,000 per year. It is listed as a full-time position. Final pay may depend on location, experience, and interview evaluation on SK hynix's official career site.
Where is the Director, System in Package Architecture job at SK hynix located?
This Director, System in Package Architecture position at SK hynix is located in San Jose, CA (On-site). Always check SK hynix's application page for specific state eligibility or relocation policies.
What qualifications are required for Director, System in Package Architecture at SK hynix?
For the Director, System in Package Architecture role, SK hynix highlights 7+ years of relevant experience; a bachelor's degree; experience with advanced packaging architecture, signal integrity, power integrity analysis, HBM architecture. Rolev.ai can score your existing resume against these requirements and show any skill gaps before you apply.
How do I apply for the Director, System in Package Architecture position at SK hynix?
This listing links directly to SK hynix's Greenhouse application page. You can apply directly on SK hynix's site, or use Rolev.ai to check your resume fit, generate a zero-hallucination tailored resume and cover letter for this posting, and autofill the Greenhouse application form in 1 click with the Rolev.ai Chrome extension. You always review the form and press Submit yourself.