Experimental Thermal & Advanced Packaging Senior Scientist - R&D

Who we're looking for

Toyota's Electronics Research Department (ERD) is looking for a passionate and highly motivated Senior Scientist specializing in advanced electronics packaging and experimental package evaluation including thermal management. This role leads hands-on experimental research and in-house prototype development in packaging and integration. The Senior Scientist will design, build, and validate hardware and test methods that enable next-generation power-electronic, optoelectronic/silicon-photonic, and emerging quantum-device applications for mobility.

Reporting to the Senior Manager, this individual will translate research concepts into integrated, measurable hardware by developing experimental setups, fabricating test samples, assembling advanced packages, and characterizing prototype performance. The primary focus is experimental integration and packaging; fundamental photonics or quantum-physics research is not required.

What you'll be doing

• Innovate, fabricate, assemble, and integrate heterogeneous packaging prototypes and test samples, including PCB-embedded modules, DBC/AMB substrates, wide-bandgap SiC/GaN devices, and electronic-photonic co-packaged concepts.
• Lead the design, construction, and commissioning of in-house test benches and experimental setups for thermal-management and power-module characterization.
• Plan and execute experiments to evaluate cooling and packaging concepts, analyze results, investigate root causes, and compare performance against state-of-the-art benchmarks.
• Develop and characterize hardware supporting next-generation, high-power-density power-converter technologies.
• Develop electronic-photonic co-packaged prototypes and provide packaging and integration support for emerging quantum-device technologies.
• Collaborate with photonic device foundries, component suppliers, and university research partners to coordinate sample fabrication, prototype assembly, and testing.
• Own project plans and technical milestones, identify risks, and drive research programs from initial concept through validated prototype.
• Communicate research findings, insights, and recommendations clearly to global stakeholders and senior leadership through presentations, technical visualizations, and written reports.
• Publish significant results in leading scientific journals and conferences and mentor junior team members in experimental methods and research best practices. Development of intellectual property across different technology and packaging platforms.

What you bring

• Must have a PH.D in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, or a related field.
• Must have 5 years of professional experience related to advanced electronics packaging, power electronics, semiconductor packaging, thermal management, or a closely related area.
• Experience with electronics packaging and heterogeneous integration, such as PCB-embedded modules, DBC/AMB substrates, die attach, wire or ribbon bonding, flip-chip assembly, or comparable assembly methods with ability to drive electrical, thermal, and mechanical co-design for robust, scalable package solutions.
• Hands-on experience building and troubleshooting laboratory test benches, thermal or cooling experiments, and in-house hardware prototypes.
• Experience in thermal management, including thermal measurement, experimental characterization, and interpretation of test results.
• Proficiency with laboratory instrumentation, data-acquisition systems, and Python-based measurement automation.
• Familiarity with wide-bandgap SiC or GaN power-semiconductor devices and their packaging requirements.
• Demonstrated ability to independently lead experimental investigations, solve ambiguous technical problems, and identify the root causes of hardware or test-system failures.

Added bonus if you have

• Experience with electronic-photonic co-packaging or EIC-PIC integration, including the integration of photonic and electronic devices within compact packages.
• Experience with optoelectronic or silicon-photonic device integration, optical gate-drive technologies, or in-situ optical sensing.
• Hands-on experience prototyping and testing power converters or power-electronic modules.
• Familiarity with packaging and integration methods for emerging quantum devices, such as NV-diamond quantum sensors.
• Experience using thermal CFD or multi-physics simulation to guide experimental design and interpret test results.
• Experience with digital twins, multi-physics simulation-driven package optimization, or package/process modeling.
• Excellent written and verbal communication skills, including the ability to explain complex research findings to international, cross-functional, and senior-leadership audiences.

What we'll bring

During your interview process, our team will provide you with all the details of our industry-leading benefits and career development opportunities. A few highlights include:

• A work environment built on teamwork, flexibility, and respect
• Professional growth and development programs to help advance your career, as well as tuition reimbursement
• Team Member Vehicle Purchase Discount
• Toyota Team Member Lease Vehicle Program (if applicable)
• Comprehensive health care and wellness plans for your entire family
• Toyota 401(k) Savings Plan featuring a company match, as well as an annual retirement contribution from Toyota regardless of whether you contribute (if applicable)
• Paid holidays and paid time off
• Referral services related to prenatal services, adoption, childcare, schools and more
• Tax Advantaged Accounts (Health Savings Account, Health Care FSA, Dependent Care FSA)
• Relocation (if applicable)

Belonging at Toyota

• Our success begins and ends with our people.
• We embrace all perspectives and value unique human experiences.
• Respect for all is our North Star.

Have a question, need assistance with your application or do you require any special accommodations? Please send an email to.