Hardware Technical Program Manager

Key Responsibilities

Own the Program

• Own the silicon schedule from architecture freeze through tapeout, bring-up, and production with the schedule informed by customer requirements and internal functional leads.
• Drive the weekly execution cadence (program reviews, design reviews, tapeout readiness) and maintain a single source of truth for status, dependencies, and decisions.

Drive Cross-Functional Execution

• Coordinate handoffs across architecture, RTL, DV/emulation, DFT, physical design, IP, package, and software
• Manage the dependency chains hardware programs live and die on: IP delivery, PDK/library releases, EDA versions, and emulation capacity.
• Run the tapeout checklist and signoff matrix (timing, power, IR/EM, DRC/LVS, DFT coverage, ECO closure, GDS handoff), holding owners to closure criteria.
• Work with supply chain/logistics for: IP acquisition, silicon arrival, ATE/loadboard readiness, lab scheduling, bug triage, and ECO/respin decision support.

Manage Risk & Decisions

• Surface risk early with mitigation options and schedule impact quantified - late IP, coverage shortfalls, convergence misses, foundry slot changes.
• Facilitate PPA, schedule, and scope tradeoffs, and document what was decided, by whom, and why.

Coordinate Externally & Report Up

• Interface with foundry, OSAT, IP, and EDA partners on deliverables, technology file releases, mask slots, and escalations; support export control/ECCN compliance with legal and operations.
• Deliver crisp executive reporting - where the program stands, what's at risk, what decision is needed and by when - across distributed teams and time zones.
• Track resource allocation and NRE/mask/license/prototype budgets against program needs.

Required Qualifications

• B.S. in Electrical/Computer Engineering, Computer Science, or equivalent; M.S. or MBA a plus.
• 7+ years in semiconductor/hardware engineering or program management, including at least 2 full SoC/ASIC programs taken from concept through tapeout and silicon bring-up.
• Working fluency in the chip design flow: RTL, functional verification and coverage closure, DFT, synthesis, PnR, STA, physical signoff (DRC/LVS/IR/EM), GDSII handoff, and post-silicon validation.
• Demonstrated ability to build and defend a bottoms-up schedule with critical path analysis and dependency mapping.
• Track record influencing without authority - earning the technical credibility to push senior engineers on commitments and dates.
• Strong written and verbal communication; able to run a room of principal engineers and an exec review with equal effectiveness.
• Hands-on with program tooling: Jira, Confluence, MS Project/Smartsheet, and familiarity with the Synopsys/Cadence/Siemens EDA ecosystem.

Desired Qualifications & Experience Requirements

• Prior hands-on engineering experience in design, DV, or physical design before moving to program management.
• Experience on advanced or FinFET nodes (16/12/7nm or more advanced) and direct foundry engagement (TSMC preferred).
• Familiarity with AI/ML accelerators, dataflow or novel compute architectures..
• Experience managing emulation/FPGA prototyping programs and pre-silicon software enablement timelines.
• Exposure to package/board co-design programs (FC-BGA, WLCSP) and OSAT coordination.
• Experience with EVK/reference board programs and customer/FAE enablement schedules.
• Familiarity with quality and compliance frameworks relevant to the target market (automotive, industrial, or security certifications).

Pay and benefits

We offer a competitive base salary for this role, generally ranging from $200,000 to $260,000, plus a 10% annual bonus, meaningful equity, and comprehensive benefits. Final compensation will depend on experience, level, and location, with flexibility for the right candidate.