Interposer System Design Analyst & Integration Engineer

About the role

HRL Laboratories, an IBM company, pioneers the next frontiers of physical and information science. Delivering transformative technologies in automotive, aerospace and defense, HRL advances the critical missions of its customers to help them remove limitations and create competitive advantage. HRL then transitions the work back to customers - ready for real-world application.

For more than 70 years, HRL’s rich portfolio of scientific discoveries and engineering innovations continues to build on each other - often in unexpected, profound and far-reaching ways. As a private company owned by IBM, HRL prioritizes purpose over profit, significantly advancing the state of the art.

Qubit Systems Laboratory (QSL) is a world leader in semiconductor spin qubits. Our broad expertise spans semiconductor growth, device design and modeling, cryogenic control, high-density interconnects and packaging, quantum architecture, and multiqubit demonstrations. Our system architecture is built entirely around scalable semiconductor manufacturing to make quantum computing affordable for practical business and scientific applications.

General Description

The Interposer System Design Analyst & Integration Engineer will develop, model, and validate the thermal and mechanical behavior of superconducting interposer systems operating in deep cryogenic environments in support of HRL’s silicon spin quantum computing efforts, and will develop metrology and verification plans and techniques for ensuring these components meet target requirements.

This role requires expertise in computational modeling, hands on manufacturing experience, and cross functional coordination to ensure robust system level performance from millikelvin to 4 K. The ideal candidate brings strong proficiency with FEM tools, cryogenic material modeling, and CAD based model creation, paired with excellent communication skills and the ability to translate complex analyses into clear recommendations.

Essential Duties

• Develop and execute detailed thermal and mechanical finite element models to evaluate the behavior of superconducting interposers and associated packaging structures across cryogenic temperature ranges.
• Build complex geometric and material models using CAD tools; generate mesh strategies, boundary conditions, and multi physics simulations appropriate for deep cryo operation.
• Collaborate with teams performing relevant thermal and mechanical measurements to validate FEM predictions, characterize material responses, and identify discrepancies between modeled and measured behavior.
• Analyze superconducting interposer materials-including silicon based, glass based, and hybrid architectures-to determine stress distributions, thermal gradients, and deformation behaviors at very low temperatures.
• Work collaboratively with process, packaging, and device engineering teams to ensure system level design choices align with cryogenic performance requirements and manufacturing constraints.
• Document simulation methodologies, material models, assumptions, and validation results while contributing to design reviews and cross functional integration discussions.
• Communicate technical findings, risks, and design implications clearly to senior management and collaborate with team members to drive data informed engineering decisions.
• Support development of cryogenic reliability strategies, including interface behavior, material compatibility, and failure mode mitigation informed by modeling outcomes.

Required Qualifications

• BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Physics, or a related field with 5+ years of relevant experience.
• Expertise with thermal and mechanical FEM modeling tools (e.g., ANSYS, COMSOL, Abaqus) and the ability to design and execute complex simulations.
• Extensive hands on experience with mechanical or thermal test methods, including fixture design, instrumentation, and interpretation of low temperature measurements.
• Familiarity with CAD tools used to construct detailed 3D models and simulation geometries.
• Deep understanding of materials used in superconducting interposers, including silicon, glass, and metal based structures.
• Experience modeling material behavior at very low temperatures and addressing the challenges associated with deep cryogenic simulations (mK-4 K).
• Strong communication skills, with the ability to present modeling assumptions, results, and recommendations to senior stakeholders as well as collaborating effectively with engineering partners.
• Strong analytical and problem solving skills, including the ability to reconcile measured data with simulation outputs.

Special Requirements

US Person Status Required

Pay Range: $172,900 - $221,600

Our salary ranges are determined by role, level, and location (California). The range displayed on each job posting reflects the target range for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process.

Benefits

HRL offers a generous and very competitive total compensation and benefits package. Our Regular/Full Time benefits include medical, dental, vision, life insurance, 401K match, gym facilities, PTO, Sick time, upward mobility, and an exciting and challenging work environment.

Non-Discrimination and Equal Employment Opportunities (U.S.)

Don’t meet every single requirement? Studies have shown that some people are less likely to apply to jobs unless they meet every single desired qualification. At HRL, we are dedicated to building a diverse, inclusive, and authentic workplace, so if you’re excited about this role but your past experience doesn’t align perfectly with every qualification in the job description, we encourage you to apply anyway. You may be just the right candidate for this or other roles.