Optoelectronic IC Package Design Director
- Pay
- $255,000 – $407,400 per year
- Location
- New Providence, NJ
- Listed
- 3 days ago
About the role
As the global leader in high-speed connectivity, Ciena builds the critical infrastructure powering the AI era. We're a technology company shaping the future of networking, guided by innovation, integrity, and collaboration. Through development opportunities, meaningful work, and flexibility, Ciena supports growth and well-being-on and off the job. Connect with a career that matters.
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting next generation optical modules.
How You Will Make an Impact
- Own and drive advanced package selection, new product BGA configuration, and package structure
- Own and manage package development schedules
- Responsible for package layout, SI/PI optimization, design verification and tapeout
- Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
- Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
- Simulate and optimize signal and power integrity and RF performance of the package design
- Interface and work with CMs and vendors for sourcing existing designs and future product development
The Must Haves
- BS in Electrical Engineering or Physics (master's or Ph. D degree is a plus)
- 10+ years hands on experience with IC package design experience
The Nice to Haves
- Substrate design experience for RF, digital, high speed and mixed signal designs
- Thorough understanding of signal and power integrity fundamentals
- Experience with Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
- Fluent in SI/PI and EM simulation tools such as SIWave and HFSS
- Experience in package design electrical review, SI/PI analysis
- Experience in package design for manufacturing reviews
- Experience in thermal and mechanical design is a plus
- Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
- Problem solver with strong engineering fundamentals
Pay Range
The annual salary range for this position in New Jersey is $255,000 - $407,400 USD.
#LI-BH #LI-Onsite
Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.
Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.
At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.
Equal opportunity and legal notices
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
From Ciena's careers page, first listed on Rolev.ai on November 6, 2026. Rolev.ai is not the employer.
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Common questions
What is the salary for the Optoelectronic IC Package Design Director role at Ciena?
The Optoelectronic IC Package Design Director posting at Ciena states compensation of $255,000 – $407,400 per year. Final pay may depend on location, experience, and interview evaluation on Ciena's official career site.
Where is the Optoelectronic IC Package Design Director job at Ciena located?
This Optoelectronic IC Package Design Director position at Ciena is located in New Providence, NJ. Always check Ciena's application page for specific state eligibility or relocation policies.
How do I apply for the Optoelectronic IC Package Design Director position at Ciena?
This listing links directly to Ciena's Workday application page. You can apply directly on Ciena's site, or use Rolev.ai to check your resume fit, generate a zero-hallucination tailored resume and cover letter for this posting, and autofill the Workday application form in 1 click with the Rolev.ai Chrome extension. You always review the form and press Submit yourself.