Optomechanical Engineer, Laser Systems

About the role

As an Optomechanical Engineer at fab2, you’ll work with a full-stack team to develop the complete set of tools and processes for fabricating semiconductor packaging devices.

We are seeking a hands-on engineer with deep expertise in designing laser-based systems and a passion for exploring new technologies. This person will play a critical role in developing hardware and optimizing processes that create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating novel methods into semiconductor packaging processes.

Responsibilities

• Own optomechanical system development from concept through operation, including mechanical design, optical layout, precision assembly, wiring, controls integration, alignment, and debug.
• Develop laser micromachining processes and equipment, including vision-based alignment and inspection systems.
• Create and validate novel IC packaging processes, from early experiments through repeatable multi-step process flows.
• Plan and execute experiments across deposition, etch, lithography, bonding, die attach, and related packaging processes.
• Collaborate closely with process, mechanical, electrical, controls, and software engineers to move quickly from concept to working hardware.
• Create and maintain design documentation, experiment records, operating procedures, and equipment maintenance requirements for safe, reliable, and repeatable operation.

Required Experience

• Hands-on experience designing, building, integrating, or fundamentally modifying process equipment or scientific instruments
• Experience with optomechanical system design and integration, including mechanical design, optics, precision assembly, wiring, controls, alignment, and system debug
• Experience developing laser micromachining processes and working with vision-based alignment systems
• Proficiency in metrology and failure analysis, including developing custom tools or methods to quantify process performance and improvement
• Ability to work independently in a fast-moving R&D environment and take ownership from initial concept through functional hardware and validated process results

Nice-to-have

• Experience with metal plating
• Exposure to advanced semiconductor packaging technologies, including interposers, through-vias, redistribution layers (RDL), hybrid bonding, thermocompression bonding, flip chip, and underfill
• Experience with ultrafast laser micromachining

Compensation

fab2 is committed to fair and equitable compensation practices. The annual salary range for this role is $130,000 - $180,000. Compensation is determined based on your qualifications and experience. Our total compensation package also includes generous equity in fab2.

Benefits

fab2 Semi offers the following benefits, subject to applicable eligibility requirements:

• Medical, Dental, and Vision insurance
• Generous Paid Time Off inclusive of Holidays and Sick Time
• Visa Sponsorship
• Life and Disability Insurance
• Paid Parental Leave
• 401(k) retirement plan
• Weekly Learning & Development opportunities
• Commuter Benefits including Parking and Late Night Uber rides from the office
• Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts

• Export Control Analysis: This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.
• fab2, formerly known as Atomic Semi