Package Layout Engineer
- Pay
- $157,000 – $176,000 per year
- Location
- Mountain View, CA · Hybrid
- Job type
- Full-time
- Level
- Senior
- Experience
- 3+ years
- Education
- Bachelor's degree
- Listed
- 30 days ago
Skills & highlights for this role
- Allegro X APD
- IC package substrates
- organic materials
Also useful
- Cadence Integrity 3DIC
- Expedition Package Designer
- SKILL scripting
- Python
Stated benefits & perks
- Health
- Dental
- Vision
- Equity
About This Role
Lightmatter is looking for a Package Layout Design Engineer to drive the next generation products from concept to development. You will be part of the Signal Integrity, Power Integrity and Packaging team, tasked with delivering substrate layouts that support the package architecture from concept, through design optimization and completion, meeting stringent signal integrity, power integrity, and design for manufacturing requirements. This position offers a unique opportunity to work on new package architectures by solving complex interactions across digital, analog and photonics domains.
Responsibilities
- Deliver IC package substrate layouts for standard and advanced packaging technologies.
- Contribute to the product concept phase by delivering preliminary substrate designs and floorplanning to support overall stack-up (Silicon/package/MB) optimization.
- Collaborate with package substrate suppliers and Outsourced Semiconductor Assembly and Test (OSAT) companies to apply layout design rules, stack up, and implementation guidelines.
- Generate fab files and coordinate with substrate suppliers and OSATs to support Design for Manufacturing (DFM) and Design for Assembly (DFA) closure.
- Design package layouts while adhering to signal integrity, power integrity, thermal, and mechanical requirements.
- Design packages incorporating analog and digital elements/interfaces.
- Support signal/power integrity engineers by providing iterative test routes to refine design rules and routing topologies.
- Coordinate across functional teams to execute error-free Package Design Tape Outs on schedule.
- Support and adapt design automation and verification activities to improve team efficiency.
Qualifications
- B.S. or M.S. degree in Electrical Engineering or similar discipline with at least 5 years of relevant experience
- Minimum 3-5 years of experience in IC package layout design.
- Proficient with Allegro X APD.
- Understanding of IC package substrates and organic materials, and their impact on package design.
Preferred Qualifications
- Educational background in IC packaging and substrate layout design.
- Familiarity with system-level validation tools such as Cadence Integrity 3DIC for package/IC codesign.
- Familiarity with layout tools (e.g., Expedition Package Designer, Pads Layout, Altium, etc.).
- Experience with layout tool scripting languages (e.g., SKILL or Python) to enable design automation.
- Exposure to or interest in early-stage architectural pathfinding and physical feasibility studies for multi-chiplet and advanced packaging architectures (2.5D/3D IC, Silicon Interposers, EMIB, Fan-Out Chip-on-Wafer, etc.).
- Experience evaluating floorplans, escape routing, bump patterns (micro-bumps / hybrid bonding), and die-to-die (D2D) interface topologies.
- Excellent communication skills and the ability to collaborate effectively in cross-functional teams.
Pay and benefits
We offer competitive compensation. The base salary range for this role determined based on location, experience, educational background, and market data.
Salary Range
total compensation goes beyond base salary, it also includes a new hire equity grant, annual performance-based equity, and other rewards that recognize your impact and contribution.
$157,000—$176,000 USD
Benefits
- Comprehensive Health Care Plan (Medical, Dental & Vision)
- Retirement Savings Matching Program
- Life Insurance (Basic, Voluntary & AD&D)
- Generous Time Off (Vacation, Sick & Public Holidays)
- Paid Family Leave
- Short Term & Long Term Disability
- Training & Development
- Commuter Benefits
- Flexible, hybrid workplace model
- Equity grants (applicable to full-time employees)
Export Control
Candidates should have capacity to comply with the federally mandated requirements of U.S. export control laws.
About Lightmatter
Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world's first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.
Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!
If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.
Lightmatter is (re)inventing the future of computing with light!
Equal opportunity and legal notices
Benefits eligibility may vary depending on your employment status and location. Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.
From Lightmatter's careers page, first listed on Rolev.ai on October 10, 2026. Rolev.ai is not the employer.
How Rolev.ai helps with this application
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Common questions
What is the salary for the Package Layout Engineer role at Lightmatter?
The Package Layout Engineer posting at Lightmatter states compensation of $157,000 – $176,000 per year. It is listed as a full-time position. Final pay may depend on location, experience, and interview evaluation on Lightmatter's official career site.
Where is the Package Layout Engineer job at Lightmatter located?
This Package Layout Engineer position at Lightmatter is located in Mountain View, CA (Hybrid). Always check Lightmatter's application page for specific state eligibility or relocation policies.
What qualifications are required for Package Layout Engineer at Lightmatter?
For the Package Layout Engineer role, Lightmatter highlights 3+ years of relevant experience; a bachelor's degree; experience with Allegro X APD, IC package substrates, organic materials. Rolev.ai can score your existing resume against these requirements and show any skill gaps before you apply.
How do I apply for the Package Layout Engineer position at Lightmatter?
This listing links directly to Lightmatter's Greenhouse application page. You can apply directly on Lightmatter's site, or use Rolev.ai to check your resume fit, generate a zero-hallucination tailored resume and cover letter for this posting, and autofill the Greenhouse application form in 1 click with the Rolev.ai Chrome extension. You always review the form and press Submit yourself.