Principal Hardware Engineer - Remote

Salary Range

$144,100.00 - $190,000.00 per year plus bonus

Please note that the salary range information provided is a general guideline only, reflecting a position based in New Hamshire. Criteria such as the candidate’s qualifications and relevant experience, the scope of the specific position, as well as market and business considerations will be evaluated when extending an offer.

We Take Care of Our People

Paid Time Off I 401K with Employer Match and Profit Sharing I Health and Wellness Benefits I Learning and Development Opportunities I Referral Program I Competitive Pay I Recognition I Employee Stock Purchase Plan I Inclusive & Supportive Culture *

Your Challenge

• Collaborate with engineering, project management, test, and operations teams in small, highly integrated, multidisciplinary teams to meet demanding, schedule-driven customer requirements.
• Lead the design and development of 3U and 6U VPX SBC, FPGA, switch, and I/O cards supporting data rates up to 400 GHz.
• Lead the design and development of custom form-factor systems that include SBC, FPGA, switch, and I/O cards, and power supplies and thermal management elements including Liquid-Flow-Through (LFT) methods.
• Support business development, program managers, and customer teams in translating requirements into practical system and functional designs.
• Assess technical and economic feasibility of new designs and act as a team/project lead.
• Provide technical leadership, introduce best practices, and improve product performance, reliability, and time-to-market (TTM).
• Direct and conduct tests to establish standards for new or modified equipment, systems, or processes.
• Develop and maintain technical procedures, documentation, and manuals.

What you Bring

• Bachelor’s degree in Electrical Engineering required; Master’s preferred.
• Minimum 15 years of experience in DoD embedded systems and hardware design (SBC, FPGA, switch, and I/O cards up to 100 GHz); 20+ years preferred.
• Extensive experience designing mixed-signal, high-speed digital, analog, and low-power, high-current circuits in high-reliability environments.
• Proficient in designing high-density interconnect (HDI) PCBs with 26+ layers, Mult lamination, blind/buried vias, and uVia structures.
• Hands-on experience with Siemens Expedition DX Designer (SCH) and Siemens Expedition PCB tools.
• Ability to prioritize tasks, drive results, and work under high-pressure, schedule-driven environments.
• Strong leadership and mentoring skills, capable of architecting and completing complex designs with schedule-based teams.
• Excellent communication skills; proficient in Microsoft Office (Excel, Outlook, PowerPoint).
• US Citizenship required; active DoD security clearance preferred.

Compliance Statement

This position may require exposure to export-controlled information and subject to additional security screening. In the event information provided during the security screening reveals ineligibility to access export-controlled information, any offer of employment may be reconsidered or withdrawn.

For US Applicants: EEO is The Law – click here for more information.

If you require accommodation due to a disability at any time during the recruitment and/or assessment process, please contact Talent Acquisition and we will make all reasonable efforts to accommodate your request.