Principal Physical Design Engineer

Role Summary

We are seeking an experienced Digital Designer for SoC Implementation / Physical Design for advanced semiconductor products. This role will own end-to-end physical design execution across complex designs, driving delivery from RTL to silicon for cutting-edge technology nodes.

The ideal candidate demonstrates deep technical expertise to implement a given design on silicon with optimized quality and meeting PPA targets.

Key Responsibilities

• End-to-End Physical Design Ownership
• Lead Physical design execution including floorplanning, synthesis, place & route, CTS, routing, STA, PDN, PDV and signoff.
• Drive timing, power, IR/EM, and physical verification closure to achieve tapeout readiness.
• Deliver optimized PPA (Power, Performance, Area) across complex designs.
• Aligns with internal expectations of implementing designs on silicon with optimal quality, PPA, and cost efficiency
• Team Leadership & Organization Development
• Participate in mentoring and career development.
• Role-Model execution discipline, review mechanisms, and performance tracking.
• Interface with senior leadership for status reporting, escalation, and decision-making.
• Technical Strategy & Innovation
• Define and deploy next-generation physical design methodologies.
• Drive automation, flow optimization, and tool innovation.
• Lead adoption of advanced node technologies (5nm and beyond).
• Improve scalability, productivity, and design quality through methodology enhancements.
• Cross-Functional & Ecosystem Engagement
• Collaborate with architecture, RTL, verification, and product teams to ensure design convergence.
• Interface with EDA vendors and IP providers for tool and flow optimization.
• Support post-silicon bring-up, yield improvement, and production ramp activities.

Core Technical Expertise

• Full RTL-to-GDSII implementation flow (Cadence and/or Synopsys tool sets)
• Floorplanning, synthesis, PNR, CTS, routing
• STA and signoff methodologies
• Physical verification (DRC/LVS/ERC)
• Advanced node implementation (≤ 16nm / 5nm)
• Low power design (UPF/CLP)
• Scripting in Python, TCL, and Perl

Required Qualifications

• Bachelor’s or Master’s in Electrical / Electronics Engineering or related field
• 10+ years of experience in ASIC / SoC physical design
• Strong knowledge of industry EDA tools (Synopsys, Cadence flows)
• Strong communication skills

Preferred Qualifications

• Experience in high-reliability SoCs
• Exposure to AI-driven design methodologies and automation

Why This Role Matters

• Own delivery of flagship SoCs at advanced nodes
• Drive innovation in physical design methodologies
• Direct impact on silicon success and product competitiveness

• More information about NXP in the United States...
• #LI-6692