R&D Engineer
- Pay
- $167,500 – $268,000 per year
- Location
- USA-CA San Jose Innovation Drive
- Listed
- 11 days ago
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About the role
The ideal candidate will have expertise in advanced packaging technology, and ‘system in package’ assembly, including manufacturability and reliability issues with wide-ranging experience in semiconductor device fabrication and operation, test development and execution, reliability failure mechanisms and testing, assembly process development and qualification, and wafer foundry manufacturing operations. Can translate system-level performance requirements into modules and collaborate directly with external foundry R&D teams, OSATs to identify and/or jointly-develop candidate technologies.
Responsibilities include
- Technical lead for multi chip semiconductor assembly and system pathfinding for leading-edge artificial intelligence and high-performance computing modules.
- Owns key portions of the advanced packaging and assembly, and system technology roadmap, and drives the development of new assembly technology from early R&D through new product introduction phases by close interaction with technical leads in system customer organizations and collaborating with internal IC design/validation teams and external foundry R&D groups.
- Defines technology requirements and roadmaps, evaluation and qualification plans, and provides hands-on applications support as technology transitions from process R&D to product development.
- Takes a leading role in advanced packaging technology problem solving, providing design and product enablement.
- Serves as the internal principal investigator for new technology projects.
- Capable of independent project management from concept phase through transfer to high-volume manufacturing, facilitating clear communication with external foundry & assembly collaborators, as well as internal design and validation teams throughout the project.
- Performs risk assessment and help to coordinate cross-functional technology risk mitigation for multiple projects in parallel.
Key Qualifications
- Broad knowledge of advanced packaging, assembly and silicon process technologies, including thermal solutions, power delivery, and both electrical and optical communication
- Experience with design of both serial and parallel interfaces both for chip-to-chip communication within module and for external module communication
- Experience with parametric and yield data analysis. Proficiency with statistical data analysis tools
- Experience with yield failure mechanisms and tools for root cause finding (EFA, PFA)
- Experience with thermal and stress simulation tools
- Exceptional data analysis, problem solving, and interpersonal skills
Education & Experience
- MSEE in Electrical Engineering or related field required and 15+ years of experience in semiconductor process technology, advanced packaging and manufacturing, specifically R&D and integration roles, or PhD and 12+ years of experience in semiconductor process technology and manufacturing, specifically R&D and integration roles
Compensation and Benefits
The annual base salary range for this position is $167,500 - $268,000.
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Equal opportunity and legal notices
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
From Broadcom's careers page, first listed on Rolev.ai on October 29, 2026. Rolev.ai is not the employer.
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Common questions
What is the salary for the R&D Engineer role at Broadcom?
The R&D Engineer posting at Broadcom states compensation of $167,500 – $268,000 per year. Final pay may depend on location, experience, and interview evaluation on Broadcom's official career site.
Where is the R&D Engineer job at Broadcom located?
This R&D Engineer position at Broadcom is located in USA-CA San Jose Innovation Drive. Always check Broadcom's application page for specific state eligibility or relocation policies.
How do I apply for the R&D Engineer position at Broadcom?
This listing links directly to Broadcom's Workday application page. You can apply directly on Broadcom's site, or use Rolev.ai to check your resume fit, generate a zero-hallucination tailored resume and cover letter for this posting, and autofill the Workday application form in 1 click with the Rolev.ai Chrome extension. You always review the form and press Submit yourself.