Signal/Power Integrity Hardware Engineer

About the role

We are looking for a driven, team-oriented Signal/Power Integrity Engineer to develop next generation Solid State Drive (SSD) products. This position requires experience in hardware design and signal and power integrity design.

A successful candidate will have a good knowledge of state of the art memory device technologies and interfaces such as PCIe Gen 4, 5 and 6, DDR4/5, ONFI NAND and implementation techniques required for high-speed interfaces. This candidate will need to have a good working knowledge of simulation tools, schematic capture tools and lab equipment (scopes, analyzers, etc.).

Expertise in design for optimum signal and power integrity as well as hands-on lab measurements experience is a must.

Responsibilities

• Mentoring of engineers.
• Provide SI/PI expertise for SSD controller package (SoC) substrate design and SSD PCB design.
• Participate in the design of SSD products which includes: design guidelines, reviewing designs, validation of designs and final reports of work designs.
• Support PCB back-end process: defining stack-up and HDI via technologies, part placement, setting routing constraints and reviews.
• Interface with cross functional teams to ensure the design meets all system level requirements through verification/validation in the lab.
• Work closely with SoC, FW, package, and circuit design engineers.
• Documentation and communication to design, product and executive teams.
• Debug and root cause analysis at all product development stages, as well as customer escalations.

Minimum Qualifications

• BS in Electrical Engineering required; MS in Electrical Engineering is a plus.
• 4-8+ years of relevant working experience.
• High-speed SSD board designs, pre layout simulation, post layout simulation and design layout guide generation for PCIe Gen4/5/6, DDR4/5, LPDDR4/4x, NVIO and PDN.
• Strong fundamentals in 3D/2D EM simulation tools and transmission line theory.
• Required experience of EM field solvers, time and frequency domain simulation tools like Sigrity, Allegro, ADS, HFSS, SIWAVE, and HSPICE.
• Simulation followed by measurement correlation using Oscilloscope, VNA and TDR equipment.
• Excellent understanding of PCB design fundamentals: single end and differential signaling, cross talk (near end and far end), signal loss and impedance control.
• Excellent written and verbal communication.

Preferred Qualifications

• Technical leader experience.
• Familiar with generating and interpreting data & eye diagrams at PCIe GENx speeds: NRZ, PAM3, PAM4, PAMx.
• High Frequency pcb low loss board material experience.
• Experience with flex circuit design for high speed signaling.
• Familiarity with PCIe operation and DRAM operation for optimizing driver and receiver equalization schemes.
• Knowledge of IBIS and ability to take common simulation outputs such as S-parameters from various components and determine at the system level that PRD requirements are met.
• Optimizing PDN and extracting PDN for PSIJ Analysis.
• Familiar with PCISIG, JEDEC and ONFI specifications and compliance.

Regarding Compensation

SK hynix memory solutions America Inc. offers you the opportunity to apply your skills to exciting projects while working with innovative teams. Our compensation package is complimented by a generous benefits package including medical, dental, vision, life insurance and a company 401(k) match, as well as cafeteria, onsite gym and much more. If you are motivated by technical challenges, we offer a collaborative work environment that encourages career growth.

The salary offered to a selected candidate will be tailored based on several factors, including the location, job grade, relevant knowledge, skills, and experience. We also take into account the internal equity among our current team members to ensure fairness and competitiveness