Thin Films Module Development Engineer
- Pay
- $155,520 – $255,200 per year
- Location
- Hillsboro, OR
- Listed
- 9 days ago
About the role
Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by developing and delivering metals modules for advanced semiconductor technologies, leveraging a combination of in-depth hardware knowledge and process expertise to deliver modules that fulfill program process needs within the hardware capabilities.
This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish a roadmap and timeline, lead with data and partner with stakeholders to deliver on-time results.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 6+ years of experience
OR
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 4+ years of experience
OR
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 2+ years of experience
Experience in semiconductor manufacturing or process development includes one or more of the following:
- Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes
- Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies
- Hands-on expertise in dry etch processes, material science, and equipment metrology
- Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials
Preferred Qualifications
- Doctoral degree in a relevant engineering or science field
- Experience with sub-10nm technology nodes and advanced device architectures like FinFET or Gate-All-Around (GAA)
- Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM)
- Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives
- Experience mentoring engineers and providing technical guidance
- Strong ownership mindset with the ability to lead initiatives from concept through implementation
Additional information
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
- Job Type: Experienced Hire
- Shift: Shift 1 (United States of America)
- Primary Location: US, Oregon, Hillsboro
Posting Statement
Position of Trust
N/A
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD
- The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
- ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Equal opportunity and legal notices
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
From Intel's careers page, first listed on Rolev.ai on October 31, 2026. Rolev.ai is not the employer.
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Common questions
What is the salary for the Thin Films Module Development Engineer role at Intel?
The Thin Films Module Development Engineer posting at Intel states compensation of $155,520 – $255,200 per year. Final pay may depend on location, experience, and interview evaluation on Intel's official career site.
Where is the Thin Films Module Development Engineer job at Intel located?
This Thin Films Module Development Engineer position at Intel is located in Hillsboro, OR. Always check Intel's application page for specific state eligibility or relocation policies.
How do I apply for the Thin Films Module Development Engineer position at Intel?
This listing links directly to Intel's Workday application page. You can apply directly on Intel's site, or use Rolev.ai to check your resume fit, generate a zero-hallucination tailored resume and cover letter for this posting, and autofill the Workday application form in 1 click with the Rolev.ai Chrome extension. You always review the form and press Submit yourself.