Package Layout Design Engineer

Position Overview

We are seeking an experienced Package Layout Design Engineer to own the physical layout and routing of large, high-density, multi-die organic packages and modules, and their associated high-speed interface boards. The role spans early routing feasibility through manufacturing release and includes high-speed serial interfaces, clock and control signals, and high-current power delivery within demanding electrical, mechanical, and fabrication constraints.

The successful candidate will work closely with package integration, ASIC, signal integrity, power integrity, mechanical, system, and manufacturing teams. This position requires strong hands-on layout capability, sound engineering judgment, and the ability to work directly with foundry, substrate, assembly, board-fabrication, and contract manufacturing partners.

Position Summary

We are seeking a Package Layout Design Engineer to support the physical layout of organic substrates and interposers for multi-die compute products. The work includes signal and power routing, bump escape, stack-up implementation, design checks, and release to manufacturing.

You will work closely with package, ASIC, signal integrity, power integrity, mechanical, and supplier teams. Candidates with hands on experience in substrate, package, interposer, or complex multilayer PCB layout are encouraged to apply.

Responsibilities

• Perform physical layout of organic substrates and interposers, including die, bump-map and netlist alignment, escape routing, signal and power routing, reference planes, via structures, and stack-up implementation.
• Develop practical routing solutions for high-speed signals and high-current power delivery.
• Support routing feasibility and work with cross-functional teams on die floorplans, I/O placement, mechanical boundaries, and package/IP interfaces.
• Apply layout constraints and coordinate with signal integrity and power integrity engineers during design implementation and review.
• Perform connectivity, DRC, DFM, and manufacturing rule checks and prepare release databases and documentation.
• Work with substrate suppliers and manufacturing partners to resolve design rule and manufacturability.
• Participate in design reviews, improve layout methods and documentation, and support related package interface board layout when needed.

Qualifications

• 5 or more years of hands-on experience with substrate, package, interposer, or complex multilayer PCB layout.
• Experience using Siemens Xpedition, or Cadence Allegro, or a similar package or board layout tool.
• Experience with high density or multilayer routing, bump escape, vias, and stack up implementation.
• Working knowledge of high-speed signal routing and/or high current power delivery.
• Understanding layout design rules, connectivity checks, DRC, DFM, and manufacturing release requirements.
• Ability to work effectively with engineering teams, suppliers, and manufacturing partners.
• Experience with multi-die or chiplet-based designs, large organic substrate and modules, supplier release, and power delivery.
• Bachelor's degree in an engineering discipline or equivalent relevant experience.

Notice to Recruiting Agencies

Eridu does not accept unsolicited resumes or candidate profiles from staffing agencies or third-party recruiters. Any candidate submitted to Eridu without prior written authorization from our recruiting team will be considered unsolicited and will become the property of Eridu. Eridu reserves the right to pursue and hire such candidates without any obligation to pay fees. Recruiting agencies are expressly instructed not to contact hiring managers, employees, or executives regarding open positions.