Technical Program Manager (Semiconductor focus)

What We're Looking For

• We're looking for technical program managers to own programs across our wafer-scale photonic systems.
• Each TPM owns one program and works embedded with the engineering team that carries most of it, from packaging and assembly to silicon and system bring-up.
• We have two openings.

• This is a hands-on role.
• You'll own the schedule, the risks and the handoffs between teams, and you'll work in the technical details alongside the engineers.
• We want someone who gets things done themselves, not someone who only tracks status.

Ideal Background

• 8+ years in semiconductor or hardware development, as an engineer, a program manager or both, with programs taken from development to working hardware
• Deep working knowledge of at least one of: advanced packaging and assembly, or ASIC/SoC and system hardware
• Communicates clearly and directly with engineers, partners and leadership
• Reads specifications closely and spots gaps, conflicts and missing owners
• Action-oriented: builds plans and schedules that engineers actually use, and drives them to done
• Experience running work with external partners (foundries, OSATs, IP or design-services vendors)

Nice to Have

• Advanced packaging (2.5D/3D, chiplet, flip chip), including complex multi-die packages
• Experience with chip-on-wafer (CoW) assembly, including mechanical stress and thermal effects
• Photonic, optoelectronic or other heterogeneous-material assemblies
• Reliability qualification, failure analysis, test vehicles and DOEs
• Advanced-node ASIC/SoC tape-outs and work with third-party IP or design-services partners
• Multi-die, chiplet or MCM programs, including chip-package co-design
• System hardware (boards, power, thermal, mechanical) through bring-up
• Optical I/O or high-speed SerDes programs
• Data-center or OCP-style hardware
• Experience with Jira and Confluence